Semiconductor/Integrated Circuit

Created on:2021-12-30

Visual inspection of electronic components


After taking high-speed and automatic photos of the surface of the analyte, the data is transmitted to the computer for processing to find out the defective products, including printing errors, content errors, image errors, direction errors, missing printing, surface defects, etc.





Chip appearance detection


Detects the number of pins and the geometry of multiple pin locations, including pitch spacing, width, height, bending, etc.






PCB printed circuit detection


Detect pcB printed circuit board component position, solder joints, lines, hole size, angle measurement; computer micro communication interface, SIM card slot; SMT component placement, surface mount, surface inspection; SPI solder paste detection, reflow soldering and wave soldering; the number of cable connectors and so on.